IMWTEK was founded in 2010 and is a high-tech enterprise specializing in the research and development, production, and sales of high-end power semiconductor devices. We have been deeply involved in the industry for 15 years, with the core concept of "innovation drives energy efficiency for the future". We are committed to providing high-performance and high reliability power device solutions to global customers, benchmarking our products against international giants Infineon and Toshiba, and achieving technological breakthroughs and cost optimization in multiple fields. At present, the company has formed a complete product matrix covering the voltage range of 20V to 1200V, with packaging technology covering international mainstream solutions such as TOLL, LFPAK, TOLL, etc., widely used in fields such as new energy, industrial automation, automotive electronics, and consumer electronics.
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Unmanned electromechanical tuning system: the lightweight revolution of QFN packaged MOSFET
IMWTEK UD1206QM and Toshiba SSM6K513 MOSFET engage in a performance showdown in the dynamic scenario of unmanned aerial vehicle tuning. UD1206QM adopts QFN 3 × 3mm packaging. Compared with Toshiba WSON solution, its RDS (on) is reduced to 1.2m Ω, Qg is reduced by 18%, and pulse current reaches 300A (increased by 20%). Actual testing shows that the transient response time of UD1206QM has been shortened to 1.2 μ s, the junction temperature is 14 ° C lower than Toshiba, and there is zero failure of solder joints after vibration, resulting in a 1.5% increase in system efficiency. The bottom pad h
2025-03-13
Electric tool motor drive: explosive power of TOLT packaged MOSFET
The IMWTEK UP009N10LT MOSFET adopts an innovative TOLT package, which is significantly superior to the Infineon IPB030N10N in electric tool motor drive. The top heat dissipation design reduces the thermal resistance to 35 ° C/W (22% lower than competitors), combined with a 2.8m Ω on resistance and 65nC gate charge, achieving 6.7% conduction loss optimization and 7% reduction in driving power consumption. Actual testing shows that the device has a fast start-up response of 10ms (82ms), a low shell temperature of 10 ° C (68 ° C) at full load, and a system efficiency of 93.5% (an increase of 1.4%
2025-03-12
Industrial robot joint drive: a high reliability solution packaged in DFN
IMWTEK UD009N06GH and Infineon IAUC50N04S7N014 MOSFET compete in performance in industrial robot joint drive scenarios. Both DFN 5 × 6mm packaged devices are designed for high vibration (20G), high temperature (85 ° C), and long lifespan (10000 hours) requirements. Tests have shown that IMWTEK has advantages in terms of 50V voltage, 3.5m Ω on resistance, and 42 ° C/W thermal resistance parameters. Its copper clip structure reduces the continuous operating junction temperature to 78 ° C (Infineon 89 ° C), with an efficiency of 95.2%. In the anti vibration test, the shear force of the IMWTEK sol
2025-03-13
Solar MPPT controller: Double sided heat dissipation design in STOLL package
IMWTEK US022N10ST and Infineon CoolMOS ™ C7 engages in a showdown in high-temperature scenarios with photovoltaic MPPT controllers. The US022N10ST adopts a double-sided heat dissipation STOLL package. Compared with the Infineon TO-247-4 single-sided heat dissipation, its RDS (on) is as low as 8m Ω (90% lower than 80m Ω), avalanche energy is 350mJ (25% higher), and thermal resistance is 15 ° C/W (junction temperature is 14 ° C lower than Infineon). Actual testing shows that the MPPT efficiency reaches 99.1% (Infineon 97.5%) at 85 ° C, with parameter drift<2% (competitor 5%) after continuous av
2025-03-13
Automotive LED Lighting: TOLL Package Low Thermal Resistance Solution
IMWTEK UP005N04CT MOSFET exhibits significant advantages over Toshiba TPH4R50AQ in matrix LED driving for automotive applications. Its TOLL packaging combined with bottom copper layer heat dissipation design reduces the thermal resistance to 38 ° C/W (16% lower than Toshiba), and the junction temperature is only 142 ° C in a 125 ° C environment, extending the lifespan of the lamp. In terms of parameters, the 4.5m Ω on resistance and 22nC gate charge achieve 13.5% conduction loss optimization and 12% driving efficiency improvement, with a dynamic response delay of 35ns and support for kHz level
2025-03-12
Server Power Redundancy Design: High Density Layout of LFPAK
IMWTEK UK1R5N08LF outperforms Infineon OptiMOS in 48V to 12V DC-DC conversion ™ 5 BSC080N10NS has better performance. The LFPAK package achieves 13% conduction loss optimization and 15% driving efficiency improvement through a 0.85m Ω on resistance, 45nC gate charge, and 1.2 ° C/W ultra-low thermal resistance. Tested at 750kHz high frequency, the peak efficiency reaches 98.4% (0.6% higher than competitors), the junction temperature is 13 ° C (92 ° C) lower, and the deviation of 4-channel parallel current is less than 3%. Reverse recovery loss reduced by 28% and passed 2000 hours of high-tempe
2025-03-12Chip based Future • Intelligent Manufacturing Excellence
Committed to innovation and breakthroughs in semiconductor technology, based on advanced manufacturing processes, we provide high-performance and high reliability discrete device solutions to global customers.
Electronic Components Industry Outlook: AI Drives New Growth in the Semiconductor Market
The semiconductor industry achieved robust growth in 2024, with sales expected to reach $627 billion, a 19% year-over-year increase. The explosion in demand for AI chips has become the primary driver, with industry sales projected to reach $697 billion in 2025 and potentially breaking the $1 trillion mark by 2030.
AI Empowers Electronic Components Industry: Smart Manufacturing and Supply Chain Optimization Lead New Revolution
With the rapid development of artificial intelligence technology, the electronic components industry is experiencing unprecedented transformation. AI-driven smart manufacturing, predictive maintenance, and supply chain optimization are becoming new industry standards, significantly improving production efficiency and product quality.
AI driven innovation in next-generation electronic components: High energy efficiency chips and intelligent sensors lead industrial upgrading
With the accelerated penetration of artificial intelligence technology towards the edge, the electronic components industry is undergoing structural changes. Innovative products such as high computing power AI chips, intelligent sensors, and adaptive power modules are reshaping the industrial chain pattern, promoting technological iteration in the fields of industrial automation, intelligent terminals, and new energy. This article will deeply analyze the technological breakthroughs and industrial application prospects of core components.
AI driven transformation of electronic components industry: MOSFET technology upgrade and supply chain intelligent reshaping
With the explosive growth of global demand for electric vehicles, energy storage, and AI computing power, the electronic components industry is ushering in a new round of technological upgrades and supply chain changes. The deep application of AI technology not only optimizes the chip design process, but also helps manufacturers improve yield, reduce power consumption, and promote performance breakthroughs of power devices such as MOSFETs in high-frequency and high-voltage scenarios. At the same time, factors such as supply and demand fluctuations, geopolitics, etc. have prompted companies to
Focusing on semiconductor core technology, integrating the advantages of the entire industry chain, serving the global market with precision quality, and helping customers achieve technological innovation and breakthroughs.
GD ICP No. 2022030985-2